View SS8026T21TB_4730357.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SS8026 1.8V 1A Positive Voltage Regulator
Features
Output current in excess of 1A Output voltage accuracy +2.5%/-2% Quiescent current typically 480A Internal short-circuit current-limit Internal over-temperature protection
General Description
The SS8026 positive 1.8V voltage regulator features the ability to source 1A of output current. The typical quiescent current is 0.48mA. Familiar regulator features such as over-temperature and over-current protection circuits are provided to prevent it from being damaged by abnormal operating conditions.
Applications
PC motherboard ADSL/Cable Modem Set -Top Box LAN switch/Hub Broadband/Router
Ordering Information
SS8026XXXXX
Packing Type Pin Option Package Type PACKAGE TYPE
T2 : SOT-89 T3 : TO 220 T4 : TO 252 T5 : TO-263 T6 : SOT-223
PIN OPTION
1 1 : V OUT 2 : V OUT 3 : GND 4 : GND 5 : V IN 6 : V IN 2 GND V IN V OUT V IN GND V OUT 3 V IN GND V IN V OUT V OUT GND
PACKING
TR : Tape & Reel TB : Tubes
Typical Application
[Note 4] : Type of COUT
IO VIN C1 1 F
Pin Configuration
SS8026
IQ
VOUT C OUT 10F
Top View
Top View
Top View
1
2
3
1
2
3
1
2
3
TO-220
TO-252 and TO-263
SOT-223 and SOT-89
Rev.2.02 12/06/2003
www.SiliconStandard.com
1 of 12
SS8026
Absolute Maximum Ratings
(Note 1) Input Voltage.......................................................................................................................7V Power Dissipation Internally Limited....................................................................... (Note 2) Maximum Junction Temperature..........................................................................................150C Storage Temperature Rang...........................................................................................-65C TJ +150C Lead Temperature, Time for Wave Soldering SOT 223 Package...........................................................................................................260C, 4s Continuous Power Dissipation (TA = +25C) SOT 89 (1) .........................................................................................................................0.5W SOT 223(1) ........................................................................................................................0.8W TO 252(1) ......................................................................................................................................................................................................1.0W
Note (1): See Recommended Minimum Footprint
Operating Conditions
(Note 1) Input Voltage.................................................................................................................2.7V~6.5V Temperature Range.........................................................................................................0C T J 125C
Electrical Characteristics
VIN =3.3V, IO = 1A, CIN = 1F, COUT =10F, All specifications apply for TA = TJ = 25C. [Note 3] PARAMETER CONDITIONS MIN TYP MAX
Output Voltage Line Regulation Load Regulation Output Impedance Quiescent Current Ripple Rejection Dropout Voltage 10mA < IO < 1A 3V < V IN < 6.5V, IO = 10mA 10mA < IO < 1A 200mA DC and 100mA AC, fo = 120Hz V IN = 3.3V f i = 120Hz,V ripple =1V P-P , Io = 100mA IO = 0A IO = 100mA IO = 500mA IO = 1A V IN = 3V(SOT 223) Output Current Continuous Test, TA = 25C, TJ 150C, V OUT within 2% V IN = 3.3V(SOT 223) V IN = 3.3V(SOT 89) Short Circuit Current Over Temperature Minimum footprint (0.0625 square inch) Mounted on 0.53 square inch pcb area Mounted on 0.16 square inch pcb area 1.764 1.800 3 30 80 480 53 880 895 950 1160 660 1 0.5 1.6 150 1.845 30 50
UNITS
V mV mV m A dB mV
mA A A A C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions
are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient te mperature is Tjmax-TA / JA. If this dissipation is exceeded, tthe die temperature will rise above 150C and the IC will go into thermal shutdown. For the SS8026 in SOT 89 package, JA is 250C/W. For the SS8026 in SOT 223 package, JA is 156C/W; in TO 252 package, JA is 125C/W. (See recommend minimum footprint). The safe operation in SOT 89, SOT 223, TO 252 package, can be seen in "Typical Performance Characteristics" (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperatures as close to ambient as possible. Note4: The output capacitor should be a tantalum or aluminum type.
Rev.2.02 12/06/2003
www.SiliconStandard.com
2 of 12
SS8026
Definitions
Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation under which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.
Rev.2.02 12/06/2003
www.SiliconStandard.com
3 of 12
SS8026
Typical Performance Characteristics
(V IN= +3.3V, CIN=1F, COUT=10F, TA=25C, unless otherwise noted.)
Output Voltage vs. Load Current
1.900 1.880 1600 1400
Dropout Voltage vs. Load Current
Dropout Voltage (mV)
0 100 200 300 400 500 600 700 800 900 1000
1.860
Ootput Voltage (V)
1200 1000 800 600 400 200 0
0 100 200 300 400 500 600 700 800 900 1000
1.840 1.820 1.800 1.780 1.760 1.740 1.720 1.700
Load Current (mA)
Load Current (mA)
Ground Current vs. Load Current
2.00 1.80 1.60
Line Transient
Ground Current (mA)
1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00
0 100 200 300 400 500 600 700 800 900 1000
Load Current (mA)
Line Transient
Rev.2.02 12/06/2003
www.SiliconStandard.com
4 of 12
SS8026
Typical Performance Characteristics
Load Transient
(continued)
Load Transient
Load Transient
Load Transient
Rev.2.02 12/06/2003
www.SiliconStandard.com
5 of 12
SS8026
Safe Operating Area of SOT 223
1200 1100 1000
Maximum Power Dissipation of SOT 223
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R cA=156C/W) J
T A=25C,Still Air
1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R cA=156C/W) J
Output Current (mA)
900 800 700 600 500 400 300 200 100 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 TA=25 J TA=55 J TA=85 J
TA=25C,Still Air
Power Dissipation (W)
0.1 0.0
25 35 45 55 65 75 85 95 105 115 125
Input-Output Voltage Differential VIN-VOUT (V)
Amibent Temperature TA (C)
Note: V IN(max) <= 6.5V
Safe Operating Area of SOT-89 [Power Dissipation Limit]
700
Maximum Power Dissipation of SOT-89
0.7
Maximum recommended output current
600
TA=25 J TA=55 J TA=85 J
0.6
500
400
1oz Copper on SOT-89 Package Mounted on recommended mimimum footprint (R cA=250 C/W) J
Power Dissipation (W)
0.5
Output Current (mA)
0.4
300
0.3
200
0.2
100
0.1
1oz Copper on SOT-89 Package Mounted on recommended mimimum footprint (R cA=250 C/W) J
0
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8
0
25 35 45 55 65 75 85 95 105 115 125
Input-Output Voltage Differential VIN - VOUT (V)
Ambient Temperature ( C)
Note: V IN(max) <= 6.5V
Safe Operating Area of SOT 223
1100
Mounted on 1 square inch, 1oz copper pcb area (R cA=70C/W) J
1000
T A=25C,Still Air
900
Load Current (mA)
800 700 600 500 400 300 200 100 0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Mounted on 0.53 square inch, 1oz copper pcb area (R cA=85C/W) J
Mounted on recommend minimum footprint, 1oz copper pcb area (See Recommend minimum footprint) (R cA=156C/W) J
2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4 4.2 4.4 4.6
Input-Output Voltage Differential (V)
Rev.2.02 12/06/2003
www.SiliconStandard.com
6 of 12
SS8026
Safe Operating Area of TO 252
1400 Maximum recommended output current 1200 TA=25 C,Still Air
Maximum Power Dissipation of TO 252
1.4 Still Air 1oz Copper on TO-252 Package Mounted on recommend mimimum footprint (R cA=125 C/W) J
1.2 1oz Copper on TO-252 Package Mounted on recommended mimimum footprint (R cA=125C/W) J
Output Current (mA)
800 TA=25 J TA=55 J 400 TA=85 J
Power Dissipation (W)
1000
1.0
0.8
600
0.6
0.4
200
0.2
0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8
0.0 25 35 45 55 65 75 85 95 105 115 125
Input-Output Voltaage Differential VIN-VOUT (V) Note: V IN(max) <= 6.5V
Amibent Temperature T A ( J )
Recommend Minimum Footprint
Rev.2.02 12/06/2003
www.SiliconStandard.com
7 of 12
SS8026
Package Information
D D1 POLISH
E HE A1 e C
MATTE FINISH
A
b
b1
b
POLISH
SOT-89 (T2) Package DIMENSIONS IN MILLIMETERS MIN NOM MAX
1.40 0.80 0.36 0.41 038 4.40 1.40 ----2.40 2.90 1.50 1.04 0.42 0.47 0.40 4.50 1.60 ----2.50 3.00 1.60 ----0.48 0.53 0.43 4.60 1.75 4.25 2.60 3.10
SYMBOLS
A A1 b b1 C D D1 HE E e
DIMENSIONS IN INCHES MIN
0.055 0.031 0.014 0.016 0.014 0.173 0.055 ----0.094 0.114
NOM
0.059 0.041 0.016 0.018 0.015 0.177 0.062 ----0.098 0.118
MAX
0.063 ----0.048 0.020 0.017 0.181 0.069 0.167 0.102 0.122
Rev.2.02 12/06/2003
www.SiliconStandard.com
8 of 12
SS8026
E A E1 E1 R F d D
D1
I
L
e b e1 b1
C A1
TO-220 (T3) Package SYMBOLS
A A1 b b1 C D D1 d E E1 e e1 F I L
MILLIMETERS MIN
4.318 2.46 0.69 1.143 0.304 3.429 8.53 2.62 9.906 2.84 2.29 4.83 1.143 3.454 13.589
INCHES MAX
4.826 2.72 0.94 1.397 0.460 3.683 9.04 2.87 10.40 5.13 2.79 5.33 1.397 3.962 14.351
MIN
0.170 0.097 0.027 0.045 0.012 0.135 0.336 0.103 0.390 0.112 0.090 0.190 0.045 0.136 0.535
MAX
0.190 0.107 0.037 0.055 0.018 0.145 0.356 0.113 0.410 0.202 0.110 0.210 0.055 0.156 0.565
Rev.2.02 12/06/2003
www.SiliconStandard.com
9 of 12
SS8026
E A E1 L1 F
D
H
L2 b e1 e
A1 L3
C
TO-252 (T4) Package MILLIMETERS MIN.
2.19 0.89 0.64 0.46 5.97 6.35 5.21 2.26BSC 3.96 0.46 0.89 0.64 2.40 9.40 0 5.18 0.58 2.03 1.02 2.80 10.40 4 0.156 0.018 0.035 0.025 0.095 0.370 0
SYMBOL
A A1 b C D E E1 e e1 F L1 L2 L3 H
INCHES MAX.
2.38 1.27 0.89 0.58 6.22 6.73 5.46
MIN.
0.086 0.035 0.025 0.018 0.235 0.250 0.205 0.09BSC
MAX.
0.094 0.050 0.035 0.023 0.245 0.265 0.215 0.204 0.023 0.080 0.040 0.110 0.410 4
Rev.2.02 12/06/2003
www.SiliconStandard.com
10 of 12
SS8026
A E A1 L3
D
H L1 C
e L2 e1 b b1 A2
L
TO-263 (T5) Package SYMBOLS
A A1 A2 b b1 C D E e e1 H L L1 L2 L3
MILLIMETERS MIN
4.30 1.22 2.45 0.69 1.22 0.36 8.64 9.70 2.29 4.83 14.60 4.70 1.20 2.24 1.40MAX
INCHES MAX
4.70 1.32 2.69 0.94 1.40 0.56 9.652 10.54 2.79 5.33 15.78 5.84 1.778 2.84
MIN
0.169 0.048 0.104 0.027 0.048 0.014 0.340 0.382 0.090 0.190 0.575 0.185 0.047 0.088 0.055MAX
MAX
0.185 0.055 0.106 0.037 0.055 0.022 0.380 0.415 0.110 0.210 0.625 0.230 0.070 0.111
Rev.2.02 12/06/2003
www.SiliconStandard.com
11 of 12
SS8026
A D B1 C
13(4X )
H
E
L e e1 L2
13 (4 X )
A1 B
SOT-223 (T6) Package SYMBOLS
A A1 B B1 C D E e e1 H L L2 a 0 6.70 0.90 MIN 0.06 BSC 10 0
MILLIMETERS MIN MAX
1.55 0.02 0.60 2.90 0.24 6.30 3.30 2.30 BSC 4.60 BSC 7.30 1.80 0.12 0.80 3.10 0.32 6.70 3.70
INCHES MIN
0.061 0.0008 0.024 0.114 0.009 0.248 0.130 0.090 BSC 0.181 BSC 0.264 0.036 MIN 0.0024 BSC 10 0.287
MAX
0.071 0.0047 0.031 0.122 0.013 0.264 0.146
Package Orientation on tape
Feed Direction TO-252, TO-263 Package Orientation
Feed Direction SOT 89, SOT-223 Package Orientation
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties.
Rev.2.02 12/06/2003
www.SiliconStandard.com
12 of 12

▲Up To Search▲

Price & Availability of SS8026T21TB

	To Download SS8026T21TB Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .